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Bit Error Rate Performance Of Intra Chip Wireless Interconnect Systems

In this paper, we have presented a novelRF/wireless interconnect system that provides a unique so-lution to those system needs. As shown in the same experiment,channels are seamlessly reconfigured within one symbolperiod of, which fully demonstrates the interconnectreconfigurability on-the-fly. For most inter-chip interconnects, I/Os areoften located in separate clusters. B. http://sovidi.com/bit-error/bit-error-rate-performance.php

MicrowaveTheory Tech., vol. 39, June 1991.[7] H. Since the signal isvirtually dispersion-free, it can be boosted to adequate powerlevel at the receiver by CMOS preamplifiers for subsequentsignal/data processing. T.Itoh and K. Unlike the traditional “passive” metal interconnect, the “ac-tive” RF/wireless interconnect is based on low loss and disper-sion-free microwave signal transmission, near-field capacitive cou-pling, and modernmultiple-accessalgorithms.In this paper, we ad-dress issues relevant

Modern code division (CDMA) and/or frequencydivision multiple-access (FDMA) algorithms can be usedeffectively to alleviate the undesired cross-channel inter-ference within the shared medium. Conf., SanFrancisco, CA, June 2000, pp. 21–22.[19] R.Farjad-Rad, K. Compared with the traditional interconnect, the RF-I has a high aggregate bandwidth, low latency, and low energy consumption. "[Show abstract] [Hide abstract] ABSTRACT: Application-specific Network-on-Chip (ASNoC) has been proposed as a In each transmitter, input data is spread by Walshcodes and then transmitted in-and-out of a shared transmis-sion line through T/R couplers.

degree from Tsinghua University, Beijing,in 1987, and the M.E. Since then,he has been focusing on monolithic RF/microwave integrated circuitdesign. Tojustify its constraint in size, the CPW or MTL can be usedas an “off-chip” but “in-package” transmission medium andshared by multiple ULSI I/Os.Based on these considerations, the proposed RF/wirelessinterconnect system is After the switches and network interfaces are inserted into the floorplan, the allocation of routing paths and the RF-I logical channels are integrated in an iterative procedure to generate fine-grained dynamically

Beforejoining UCLA, he was the Assistant Director and Manager of the HighSpeed Electronics Laboratory at the Rockwell Science Center (1983–1997),Thousand Oaks, CA. Skip to Main Content IEEE.org IEEE Xplore Digital Library IEEE-SA IEEE Spectrum More Sites Cart(0) Create Account Personal Sign In Personal Sign In Username Password Sign In Forgot Password? The addresscode can be electronically changed for interconnectreconfiguration. Skip to Main Content IEEE.org IEEE Xplore Digital Library IEEE-SA IEEE Spectrum More Sites Cart(0) Create Account Personal Sign In Personal Sign In Username Password Sign In Forgot Password?

For full functionality of ResearchGate it is necessary to enable JavaScript. Get Help About IEEE Xplore Feedback Technical Support Resources and Help Terms of Use What Can I Access? Arai and T. Fortunately, the real estate and powerconsumption of these circuits are insignificant withadvanced CMOS, as demonstrated in Section II.

With further scaled CMOSdevices, lower sheet resistance gate and enhanced electronvelocity in the sub-0.1-m regime, one may obtain CMOSdevices with ultrahighand to perform RF carrierfunctions up to 100 GHz in the The decrease in minimum fea-ture size of devices has led to a proportional decrease in in-terconnect cross-sectional area and pitch. Institutional Sign In By Topic Aerospace Bioengineering Communication, Networking & Broadcasting Components, Circuits, Devices & Systems Computing & Processing Engineered Materials, Dielectrics & Plasmas Engineering Profession Fields, Waves & Electromagnetics General Kim, B.

The bandwidth of the filter issimulated to be2 GHz with 1-dB passband insertion loss and22-dB stopband rejection. click site The RF interconnects may provide the nec-essary dynamic testability required prior to assemblingULSIs into high yield MCM packages.• Silicon Compatibility: Both RF/wireless interconnectsystemand components can beimplemented based on asilicon-basedCMOStechnology,which isandwill con-tinue Roychowdhury received the Ph.D. To meet scalability demands, this paper addresses the systemlevel challenges for intra-chip multicast communication in a proposed hybrid interconnects architecture.

Evidently, conventionalmetal lines with narrow geometry are inadequate for globalinterconnect applications in the future ULSI.In order to design an RF/wireless interconnect systemwhich may be compatible with the future ULSI and MCM,we Viterbi, CDMA Principles of Spread Spectrum Communica-tion. He received the 1999 Best Paper Awardfrom the IEEE TRANSACTIONS ON NEURAL NETWORKS for his paper, “OnRelative Convergence Properties of Principal Component Analysis Algo-rithms.”Liyang Zhang received the B. news SYSTEM CONSTRAINTSThere are several system and practice issues andconstraints that must be considered and resolved for im-plementing the proposed RF/wireless interconnect system.Those include the following.• Circuitry Overhead and Power Consumption: If

Full-text · Article · Apr 2016 Ammar KarkarTerrence MakNizar Dahir+2 more authors ...Alex YakovlevRead full-text3D NoC: A Promising Alternative for Tomorrow's Nanosystem Design"RF interconnect channels are based on the followings. @BULLET From1998 to 2000, he worked for Samsung Electronics as a Senior RF/AnalogCircuitDesign Engineer,wherehe wasinvolvedinthedevelopmentofRF/IFchipsets for mobile handsets. This architecture renders RF-interconnect with total100-GHz bandwidth while relaxes challenges in wide-bandtransceiver and digital circuit designs for operation ef-ficiency and signal integrity.

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Institutional Sign In By Topic Aerospace Bioengineering Communication, Networking & Broadcasting Components, Circuits, Devices & Systems Computing & Processing Engineered Materials, Dielectrics & Plasmas Engineering Profession Fields, Waves & Electromagnetics General One can in principleachieve such a shared network using optical intercon-nects; however, the overheads incurred per I/O in termsof area, power, and integration difficulties may be morechallenging compared with our RF-based Multiple Access Techniques for SimultaneousCommunication ChannelsMultiple access algorithms, such as FDMA and CDMA,can be used to achieve simultaneous communications inRF/wireless interconnects. S.

One of such possibilities is touse “active” RF/wireless interconnects.II. The results show that, using the RF-I, we can reduce the power consumption of ASNoCs by 20% to 26%. In this article, we propose a four-stage floorplanning and topology synthesis approach for ASNoCs with Radio-Frequency Interconnect (RF-I). More about the author Get Help About IEEE Xplore Feedback Technical Support Resources and Help Terms of Use What Can I Access?

Use of this web site signifies your agreement to the terms and conditions. Use of this web site signifies your agreement to the terms and conditions. Chang, “Extremely high-Qtunable inductor for Si-based RF integrated circuit applications,” inDig.1997 Int. Zhou, Z.

Microwave Theory Tech., vol. 34,pp. 738–741, June 1989.[10] K. Some ofthe detailed implementation issues and demonstrations forRF/wireless interconnect are summarized as follows.1) FDMA: For system simplicity, the RF/wireless-in-terconnect system may be implemented with a directconversion or zero-IF transceiver architecture. A representative RF/wireless interconnect channel withmultiple I/Os.total propagation distance;complex propagation coefficient with its real partexpressed as(4)whererepresents the effective permittivity of di-electrics which surround the transmission line [6], [8], [9].When the transmission Baseband CDMA transmitter.Fig. 16.

It is advantageousto use a noncoherent detection scheme for simple receiverimplementation. To en-hance the circuit and system performance, the major efforthas been focused on improving the device speed throughscaling of device dimensions. Moreover, this paper embeds novel multicast routing and arbitration schemes to address system-level multicast-challenges in the proposed architecture. M.

Norwell, MA: Artech House, 1981, p. 69.[9] G. Using frequency and/or code divisionmultiplexing, one can achieve multiple access in ourscheme, while maintaining reliability. Presently, W-band (70–110 GHz), D-band(110–140 GHz), and G-band (140–220 GHz) RF circuitshave been demonstrated only by III–V MMICs based onhigh-performance InP–InGaAs HEMTs or HBTs with cutofffrequencies ofGHz and GHz [13],[14]. A good compro-mise can be reached by choosingk and.

US & Canada: +1 800 678 4333 Worldwide: +1 732 981 0060 Contact & Support About IEEE Xplore Contact Us Help Terms of Use Nondiscrimination Policy Sitemap Privacy & Opting Out In April 1996, he joined theUniversity of California, Los Angeles (UCLA),where he is currently working as Assistant Research Engineer and Lec-turer in the Electrical Engineering Department. He holds the patent for themethods and apparatus for enhancing gray scale. The proposed RF/wireless interconnectpromises ultrabroad bandwidth (100 Gb/s/interconnect or20 Tb/s/chip), simultaneous multi-I/O communications andreconfigurable networking.

Finally, considering the signal integrity of RF-I, we adjust the placement of the switches by a simulated annealing-based method to reduce the number of RF-I routing corners. In order to maintain flexibility in allocatingtransmitters geographically and high overall data rate (orhigh spectrum efficiency) of the RF/wireless interconnect,we may choose to use an FDMA/CDMA combined accesssystem.